| 摘要 |
<p>PROBLEM TO BE SOLVED: To selectively polish a surface to be polished at a stable polishing speed without generation of flaw in a highly flat condition. SOLUTION: This method performs polishing on a surface to be polished by using a mixed liquid of 0.5-10 wt.% of a liquid A containing cerium oxide particles, 0.003-0.3 wt.% of surface active agent and water and a liquid B containing 1-50 wt.% of surface active agent and water.</p> |
