发明名称 GOLD OR GOLD ALLOY PLATING MATERIAL FOR ELECTRONIC PARTS AND ITS PRODUCING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain an extremely excellent gold or gold alloy plating material small in deterioration in heat resistance, corrosion-resistance and contact resistance between gold or gold alloy plating parts, which has not been realized heretofore. SOLUTION: As an intermediate layer, alloy plating of a nickel-phosphorous- boron series or a nickel-phosphorous-boron-cobalt series is applied to deposit a film of a phosphorous compound on the surface of gold or gold alloy plating as a surface layer, and before the deposition of a phosphate film, heat treatment is suitably executed, by which an extremely good gold or gold alloy plating small in heat resistance, corrosion-resistance and contact resistance between gold or gold alloy plating parts can be obtained.
申请公布号 JP2001089895(A) 申请公布日期 2001.04.03
申请号 JP19990267276 申请日期 1999.09.21
申请人 NIPPON MINING & METALS CO LTD 发明人 ASAHARA HAJIME;FUKAMACHI KAZUHIKO
分类号 C25D11/36;C23C28/00;C25D3/56;C25D5/12;C25D5/48;C25D7/00;(IPC1-7):C25D7/00 主分类号 C25D11/36
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