Apparatus for partially removing plating films of leadframe

摘要

An apparatus for partially removing plating films of a leadframe includes a mask member having annular openings configured to coincide with the predetermined areas of the leadframe for which plating films are not required; a mask supporting means having outflow channels to introduce a film removing liquid, film removing liquid outflow holes, film removing liquid inflow channels, and an insoluble cathode wire housing groove; a mechanism for supplying a power to continuously run an insoluble cathode wire; and a mechanism for masking and dismasking the upper surface of the leadframe placed at a predetermined position of the mask supporting member. In this way, the plating films deposited outside an area for which plating is necessary are easily removed and cost can be reduced.