| 摘要 |
PROBLEM TO BE SOLVED: To make a secure bump connection of a semiconductor device without spoiling the connection reliability, even if the substrate has a large curvature. SOLUTION: Bumps 9, formed at an electrode part 8 of a carrier substrate 2, are different in height from the curvature of a printed wiring board. For example, when there are four regions of 0, 30, 60, and 90 μm in curvature of substrate electrode on the printed wiring board to which the bumps 9 are connected, four kinds of bumps 9a to 9d are formed on the semiconductor device 1. In the region of 0 μm curvature, the solder bump 9a of standard bump height is formed. In the regions of 30, 60, and 90 μm curvature, the bumps 9b to 9d which are 30, 60, and 90 μm higher than the bump 9a are formed respectively. Connection reliability can be improved by mounting the semiconductor device via these bumps 9a to 9d.
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