| 摘要 |
PURPOSE:To improve brazing properties and to enhance reliability since a brazing layer becomes a predetermined thickness by brazing by using a soft brazing material containing filler formed by rolling a laminate in which a surface layer is made only of soft brazing material and which has a layer containing many fillers in a layer state therein. CONSTITUTION:Fillers 3 are scattered on a band solder having 50mum of thickness. The three solders are superposed, a band solder on which no filler is scattered is further superposed thereon, and a laminate is rolled to 80mum thick by means of a pressure roll. Thus, a solder plate in which fillers 3 are contained and not exposed on the surface is obtained. A high voltage rectifying device is manufactured by using this solder plate 1. A semiconductor piece 4 is formed by diffusing doner and acceptor from both side surfaces of an Si substrate, providing an Ni electrode 5, and cutting it in a square shape. The pieces 4 are superposed on the plate 1, electrodes 6 of heads of a conductor terminal 7 are brought into contact with both ends, heated, and soldered. Then, both sides are covered with JCR 8, and sealed with resin 9. |
