发明名称 THERMO COMPRESSION BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent unevenness of a temperature distribution of a heater tool and to homogeneously connect a long work by forming the tool of a heater material having a negative temperature coefficient of resistance. SOLUTION: A heater tool 50 is formed by laminating a heater material 50A having a negative temperature coefficient of resistance and an electrical insulating material 50B having high thermal conductivity. As the material 50A, conductive ceramics such as, for example, a sintered silicon carbide is suitable. As the material 50B, a sintered aluminum nitride is suitable, and they are ceramic mounted on a lower surface (compression bonding surface of a work) of the material 50A. A lower surface of the material 50B becomes a flat compression bonded surface 50C, which is longer than a compression bonding area of the work 26. The tool 50 of a linear bar-like state of a rectangular section is engaged within a groove 48 of a heater tool holder 4 and held. Thus, since the material 50B having the high thermal conductivity is laminated on the compression bonding surface side of the work, a temperature of the surface 50C is made uniform.
申请公布号 JP2001079949(A) 申请公布日期 2001.03.27
申请号 JP19990255180 申请日期 1999.09.09
申请人 NIPPON AVIONICS CO LTD 发明人 MURAKAMI KATSUYUKI
分类号 B29C65/30 主分类号 B29C65/30
代理机构 代理人
主权项
地址
您可能感兴趣的专利