发明名称 WATER-BASED RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a molding compound composition improved in environmental problems and subject to uniform curing reaction, to obtain the subject resin composition suitable for producing such a molding compound composition, and to provide a method for producing such a water-based resin composition. SOLUTION: This thermosetting water-based resin composition comprises a polycondensation-based resin 3-100 mgKOH/g in acid value with an unsaturated dicarboxylic acid or anhydride thereof having radical-polymerizable unsaturated bond being at least one of the constitutent monomers, an oil-soluble initiator 90-270 deg.C in one-minute half-life temperature contained in the above polycondensation-based resin and an acetylene glycol compound of the formula (R1 to R4 are each a 1-6C straight-chain or branched-chain alkyl group; m and n are each an integer of >=0).
申请公布号 JP2001081144(A) 申请公布日期 2001.03.27
申请号 JP19990259469 申请日期 1999.09.13
申请人 KAO CORP 发明人 SAKUMA TADASHI;KAWABE KUNIYASU
分类号 C08L67/06;C08F2/10;C08F238/00;C08F283/01;C08L77/12;(IPC1-7):C08F283/01 主分类号 C08L67/06
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