发明名称 WAFER DRYING DEVICE, METHOD AND IPA MIST SPRAY DEVICE FOR WAFER DRYING DEVICE
摘要 PROBLEM TO BE SOLVED: To eliminate the need to provide a nitrogen gas feeding passage and a liquid-phase IPA(Isopropyl Alcohol) feeding passage in an IPA mist spray device for a wafer drying device, and to contrive to make it possible to stabilize the mixing ratio of IPA with nitrogen gas in each jet part in the spray device. SOLUTION: This spray device is provided with an IPA mist forming part 34 which forms the IPA mist by making nitrogen gas mixture with liquid-phase IPA, and an IPA mist spray part 37 which has IPA mist jet nozzles on an IPA mist jet side and makes the mist formed in the forming part 34 jet toward a wafer through the jet nozzles.
申请公布号 JP2001077077(A) 申请公布日期 2001.03.23
申请号 JP19990251522 申请日期 1999.09.06
申请人 TOHO KASEI KK;DAIKIN IND LTD 发明人 WASHIMI KOJI;KAWANISHI TAKANORI;MAEDA TOKUO;AIHARA MASARU;ONO MASAO;IZUMITANI NAOAKI
分类号 B08B3/04;B05B7/04;F26B5/16;H01L21/304;(IPC1-7):H01L21/304 主分类号 B08B3/04
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