| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board, in which a polyimide, a conductor layer thereon, and boundaries thereof can be formed in a manner such that they withstand the work of chemicals used in an electroless plating step or a thermal load, and of which adhesion durability after thermal load, as well as adhesion of the boundary between the conductor layer and board after electroless plating, is still superior, even after thermal loading. SOLUTION: In this flexible printed wiring board, which is formed by a conductor layer on a polyimide film 1, a metallic layer 3 is adhered on the polyimide film 1 by means of a tantalum carbide layer 2, a titanium carbide layer or an amorphous carbon layer. The tantalum carbide layer 2 is a tantalum-containing hydride amorphous carbon layer containing a hydrogen, or the titanium carbide layer a titanium-containing hydride amorphous carbon layer containing a hydrogen, or the amorphous carbon layer is made of a hydride amorphous carbon layer containing hydrogen.
|
