| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonding device which can be operated in a high rate by intensively and continuously generating spark surely between a metallic wire and a torch. SOLUTION: A bump bonding device is provided with a capillary, which passes a gold wire, a torch 4 which forms a gold ball at the lower edge of the gold wire, by generating spark between the lower edge and a torch holder 1 which holds the torch 4. The bump bonding device is provided with an insulating part 1A, which directly connects a high voltage cable 17a to a spark power source with the torch 4, directly supplies a voltage to the torch 4, and insulates the torch 4 from another metallic part. |
