发明名称 |
ELECTRICAL DEVICES AND PROCESS FOR MAKING SUCH DEVICES |
摘要 |
A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1), in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. |
申请公布号 |
WO0120619(A2) |
申请公布日期 |
2001.03.22 |
申请号 |
WO2000US25118 |
申请日期 |
2000.09.13 |
申请人 |
TYCO ELECTRONICS CORPORATION;HETHERTON, SCOTT;MONTOYA, WAYNE;BRUGUIER, THOMAS;DAERING, RANDY |
发明人 |
HETHERTON, SCOTT;MONTOYA, WAYNE;BRUGUIER, THOMAS;DAERING, RANDY |
分类号 |
H01C1/14;H01C7/02;H01C7/18;H01C13/02;H01C17/00;H05K3/00;H05K3/40;(IPC1-7):H01C7/02 |
主分类号 |
H01C1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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