| 摘要 |
PROBLEM TO BE SOLVED: To improve fixing precision of a CCD chip to a ceramic laminate and position a CCD package highly precisely to an optical system. SOLUTION: A plurality of grooves 19 extending is the lamination direction of a ceramic laminate are formed on an outermost circumferential surface thereof except a ceramic substrate 12a of an uppermost layer. Observation is carried out by means of an optical microscope 26 from an upper layer side by emitting illumination light from a lower layer side of the ceramic laminate at a position wherein the groove 19 is formed. Since illumination light reaches a ceramic substrate 12a in an uppermost layer through the groove 19, a shadow boundary X' by an outer circumferential edge X of the ceramic substrate 12a in an uppermost layer can be observed by an optical microscope. An interlock position of the CCD chip 14 can be decided in reference with a position coordinate of the shadow boundary X'.
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