发明名称 METHOD OF MOUNTING OPTICAL AND ELECTRICAL DEVICES, AND MOUNTING STRUCTURE
摘要 <p>A structure of an optical module, including optical and electrical devices, is provided to allow temporarily mounting with large angular tolerance and automatic final mounting with accuracy. The structure comprises a substrate with a plurality of first metal pads, a mounting part with second metal pads corresponding to the first metal pads, and solder bumps for joining the first and second metal pads while allowing the corresponding pads to meet by the surface tension when melted. Two or more metal pads, larger than the other pads, are provided on central part of the substrate and/or mounting part.</p>
申请公布号 WO2001020660(P1) 申请公布日期 2001.03.22
申请号 JP1999004908 申请日期 1999.09.09
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