Prepreg für Leiterplatten

摘要

A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or electrically insulating short fibers dispersed in the semi-cured thermosetting resin and, if necessary, the prepreg being provided on a carrier film is suitable for producing multi-layer printed circuit boards of reduced thickness, high wiring density and high connection reliability with high productivity and low production cost.