| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for chemically and mechanically polishing a substrate by use of a fixed abrasive belt. SOLUTION: This chemical mechanical polisher has a substrate holder holding a substrate, a continuous abrasive belt 60, and a backing member 62. The abrasive belt 60 has a first layer 22 including a first face of a fixed abrasive polishing material, and a second layer 20 including a second face of a flexible film material. In use of the belt 60, the first face of the belt 60 contacts with at least a part of the substrate held by the substrate holder during moving of the belt 60 to a first direction in a nearly linear route relatively to the substrate. The backing member 62 is disposed on the second face of the belt 60. |
