| 摘要 |
A polishing apparatus prevents uneven wear of the platen and improves the operating rate of the apparatus. The polishing apparatus provided with a platen (1) divided into an inner peripheral platen portion (11) and an outer peripheral platen portion (13) and with a carrier (5) wherein by making the inner peripheral platen portion (11) and the outer peripheral platen portion (13) rotate in opposite directions and setting the rotational speeds of the inner peripheral platen portion (11) and the outer peripheral platen portion (13) so that the mean relative speed of a wafer (200) and the inner peripheral platen portion (11) and the mean relative speed of the wafer (200) and the outer peripheral platen portion (13) become substantially equal, it becomes possible to make the amount of wear of the polishing pad (11a) of the inner peripheral platen portion (11) and the amount of wear of the polishing pad (13a) of the outer peripheral platen portion (13) substantially equal. Preferably, the wafer (200) is made to oscillate so that the wafer (200) overhangs from the inner edge of the inner peripheral platen portion (11) and the outer edge of the outer peripheral platen portion (13). <IMAGE> |
