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发明名称
Lead-free solder
摘要
A lead-free solder composition comprising: 20 to 30 wt. % bismuth, 1.0 to 3.0 wt. % silver, 0.01 to 2.0 wt. % copper, 0.01 to 4.0 wt. % antimony and incidental impurities, the balance being tin.
申请公布号
IL132555(D0)
申请公布日期
2001.03.19
申请号
IL19980132555
申请日期
1998.04.22
申请人
ECOSOLDER INTERNATIONAL PTY. LIMITED
发明人
分类号
B23K35/26;C22C13/02;H05K3/34;(IPC1-7):C22C
主分类号
B23K35/26
代理机构
代理人
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