| 摘要 |
PURPOSE:To provide an electronic circuit component which has bumps which can be formed by a dry process and bonded with a small pressure. CONSTITUTION:An extra-fine particles produced in an extra-fine particle producing chamber 4 are conveyed to a film forming chamber 5 with gas 9 and spouted out from a nozzle 13 with a high speed against an electronic component 1 to form bumps 2 composed of extra-fine particle films on the surface of the electronic circuit component 1. |
