发明名称 ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS MANUFACTURE, AND COPPER PLATED LAMINATE PROVIDED THEREWITH
摘要 PROBLEM TO BE SOLVED: To enable a carrier foil to be stably separated from an electrolytic copper foil with a small force at its interface with the copper foil, by a method wherein a bonding interface layer is formed on the one surface of the carrier foil by use of thiocyanuric acid, a copper foil is electrolytically separated out on the bonding interface layer, and a separated copper layer is used as the electrolytic copper foil. SOLUTION: A carrier foil 3 rolled out from a feeder is dipped into a pickling tank first, a grease component attaching to the carrier foil 3 is removed, and the surface oxide film is eliminated. The carrier foil 3 is taken out from the pickling tank and then introduced into a bonding interface forming tank. The bonding interface forming tank is filled up with a water solution of pH 5, kept at 40 deg.C, and contains a thiocyanuric acid of concentration 5 g/L. Therefore, the carrier foil 3 is dipped into the above solution as it travels, by which a bonding interface layer 8 is formed on the surface of the carrier foil 3. When the bonding interface layer 8 is formed, and then a bulk copper layer 9 of electrolytic copper foil is formed.
申请公布号 JP2001068804(A) 申请公布日期 2001.03.16
申请号 JP19990244331 申请日期 1999.08.31
申请人 MITSUI MINING & SMELTING CO LTD 发明人 KATAOKA TAKU;HIRASAWA YUTAKA;YAMAMOTO TAKUYA;IWAKIRI KENICHIRO;HIGUCHI TSUTOMU;SUGIMOTO AKIKO;YOSHIOKA ATSUSHI;OBATA SHINICHI;TOMONAGA SAKIKO;DOBASHI MAKOTO
分类号 C07D251/32;C25D1/04;C25D1/22;C25D3/38;C25D5/54;H05K1/09;H05K3/00;H05K3/02;(IPC1-7):H05K1/09 主分类号 C07D251/32
代理机构 代理人
主权项
地址