HYBRID INTEGRATED CIRCUIT DEVICE AND BOARD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve connection strength of a lead plate by installing a printed board on which a charging and discharging circuit of a battery is formed integrally with a battery. SOLUTION: Solder resist 10 is so patterned that a solder fillet 14 is formed from an overlapping side surface of a pad electrode 2 formed on a small board 1 to the back of a lead plate 4. Since spacers are formed on a frame plate and the small board 1, the back of the lead plate 4 can be leaned. As a result, subsequent spot welding can be realized excellently without generating defects.