发明名称 Wiring board and wiring board module using the same
摘要 <p>A wiring board module has two wiring boards (A, A') placed on an external circuit board (B). In each wiring board (A, A'), a terminal end of a laminated waveguide tube (5) is exposed at a lateral side of a dielectric substrate (1), thus forming an. exposed face (6), and the dielectric substrate (1) is provided at the bottom thereof in the vicinity of the exposed face with connection pads (8a, 8b) to be used for mounting the wiring board (A, A') on the surface of the external circuit board (B). The exposed faces (6) of the laminated waveguide tubes (5, 5') of the two wiring boards (A, A') are contacted with each other, and the connection pads (8a, 8b, 8a', 8b') at the bottoms of the wiring boards (A, A') are connected and fixed to connection pads (11a, 11b, 11a', 11b') disposed on the surface of the external circuit board (B) (Fig. 3B). <IMAGE></p>
申请公布号 EP1244172(A2) 申请公布日期 2002.09.25
申请号 EP20020006715 申请日期 2002.03.22
申请人 KYOCERA CORPORATION 发明人 KORIYAMA, SHINICHI
分类号 H05K1/11;H01L23/12;H01L23/15;H01P1/04;H01P3/12;H05K1/02;H05K1/14;H05K3/34;H05K3/46;(IPC1-7):H01P3/12 主分类号 H05K1/11
代理机构 代理人
主权项
地址
您可能感兴趣的专利