发明名称 METHOD AND DEVICE FOR ARRANGING METAL BALLS
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for arranging metal balls to mount the metal balls in batch to a target by which the metal balls can be reliably separated from metal ball suction holes even when the number of metal balls to be transferred is increased and the ball diameter is reduced. SOLUTION: Metal ball suction holes 6 are arranged in a arrangement plate 5 of a metal ball arranging jig 1 to suck metal balls 4 to the metal ball suction holes 6. Subsequently, the sucked metal balls 4 are transferred to a target 2 to mount the metal balls 4 in a batch. In this method for arranging metal balls, the arrangement plate 5 is formed of a metal foil. The thickness of this metal foil and the diameter of the metal ball suction hole 6 are determined so that the top portions of the metal balls 4 are projected from the rear surface side of the arrangement plate 5 when the metal balls 4 are sucked from the surface of the arrangement plate 5 to the metal ball suction holes 6. When the sucked metal balls 4 are transferred to the arrangement target 2, the metal balls 4 are separated from the metal ball suction holes 6 by pressing a pressure tool 7 to the metal balls 4.
申请公布号 JP2001068494(A) 申请公布日期 2001.03.16
申请号 JP19990239840 申请日期 1999.08.26
申请人 NITTETSU MICRO METAL:KK 发明人 HAYASHI NOBUMITSU;UJITA JUNICHI
分类号 B23K26/00;B23K26/38;C25D1/00;H01L21/60;H01L23/12;H05K13/04 主分类号 B23K26/00
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