| 摘要 |
PROBLEM TO BE SOLVED: To implement mounting even to warped substrates under a determined bonding condition by providing a manufacturing apparatus with a means for positioning a semiconductor chip to a substrate, means for fixing onto a stage, a bonding tool for bonding to the substrate through electrodes, a support head, and a means for sucking and fixing to the stage. SOLUTION: A bonding unit 10 has a conveyor 12 in the rear of its table section 11, and a semiconductor chip supply mechanism 20 in the front side of the conveyor 12. A pickup tool 30 and a bonding mechanism 40 are provided respectively to the right of and behind the mechanism 20. A control section 100 is provided, which is linked with a coating mechanism 70 located upstream of a bonding stage 60 ahead of the conveyor 12. Then, the conveyor 12 intermittently transfers substrates W held by their carriers C in a Q direction indicated by the arrow. The mechanism 20 rotatably supports a supply table 21, where a support member 23 is mounted on a movable body 22 that moves in the X and Y directions. The tool 30 has a drive section 31, while a rotational position determining support section 43 has a head 50.
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