| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve a flip chip packaging by forming a parallel plate capacitor, in which a dielectric material is sandwiched between a pair of electrodes on a substrate, and forming bumps higher than the capacitor on the electrodes. SOLUTION: First, on a substrate 101, a parallel plate capacitor is formed in which a dielectric film 104 is sandwiched between a lower electrode 102 and an upper electrode 103. Next, bumps 105 are formed on the lower electrode 102 and the upper electrode 103. In this case, the bumps 105 are higher than the capacitor including the upper electrode 103. Further, the dielectric 104 is made of a material selected from benzocyclobutene, perfluorocyclobenzobutane, and so on. Consequently, without the necessity for a thermal welding step, it is possible to make connection to an electronic circuit substrate using a flip chip method, to improve reliability and production, and to cut the cost.</p> |
