| 摘要 |
PROBLEM TO BE SOLVED: To enable jointing in a wide temperature area, and stably joint an aluminum board and a ceramic substrate for a circuit by using an Al alloy including a specific proportion of Ge, Si and Mg as a brazing material for jointing a ceramic substrate and a metallic plate which is mainly composed of aluminum. SOLUTION: This Al alloy includes, at weight portion, 2-30 Ge, 0-13 Si, and 0.05-5 Mg. It is preferable that a ceramic substrate is any of aluminum nitride, silicon nitride, silicon carbide or alumina. Ge, an element for lowering a liquid phase generating temperature, is added and Mg, an element for heightening surface active between the ceramic substrate and the aluminum metallic plate is added so as to obtain a brazing material for an Al circuit which can be jointed in a wide temperature area and endure the power module purpose. The jointing temperature is in a range of 450 deg.C-640 deg.C, and the jointing temperature is lowered as the contents of Ge, Si and Mg get more. It is desired that the style of the brazing material is an alloy foil for obtaining stable jointing.
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