发明名称 Semiconductor device and method for producing the same
摘要 In the production of thin film transistor (TFT), a gate insulating film is formed to cover an active layer, a titanium nitride film is formed on the gate insulating film, and an aluminum film used as the gate electrode is formed on the titanium nitride film. The resulted configuration prevents the etching of the aluminum film from the insulating film side even if the etchant of aluminum enters the recessed portion at the edge of the active layer during the patterning of the gate electrode. Also in the anodizing process, when an oxide film is formed on the surface of the aluminum film, the oxidation of aluminum from the gate insulating film side is prevented even when the electrolyte solution enters the recessed portion at the edge of the active layer.
申请公布号 US6201281(B1) 申请公布日期 2001.03.13
申请号 US19960635283 申请日期 1996.04.19
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MIYAZAKI MINORU;MURAKAMI AKANE;TERAMOTO SATOSHI
分类号 H01L21/28;G11C11/56;H01L21/336;H01L29/40;H01L29/423;H01L29/49;H01L29/78;H01L29/786;(IPC1-7):H01L27/01;H01L29/76 主分类号 H01L21/28
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