发明名称 |
Substrate for mounting electronic part having conductive projections and process for manufacturing the same |
摘要 |
A plurality of side-surface patterns 11 and 12 are disposed on the wall surfaces of a mount opening portion 2 for mounting electronic parts thereat. The mount opening portion includes projection portions 21 that project toward an interior thereof from the wall surfaces thereof. End portions of the respective side-surface patterns 11 and 12 extend to the side surfaces of the projection portions 21. Also, a plurality of side-surface patterns can be provided on the wall surfaces of the mount opening portion by etching the side-surface pattern non-formation portions of the conductive layer formed on the entirety of the wall surfaces of the mount opening portion in a state where the side-surface pattern formation portions are coated with a side-surface pattern resist film made of a negative photosensitive resin. With this structure, the side-surface patterns can be prevented from being peeled off, and side-surface patterns having a plurality of potentials can be readily formed.
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申请公布号 |
US6201185(B1) |
申请公布日期 |
2001.03.13 |
申请号 |
US19980091505 |
申请日期 |
1998.09.09 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ISHIDA NAOTO;HAYASHI TERUO;TSUKADA KIYOTAKA |
分类号 |
H05K1/18;H01L21/48;H01L23/055;H01L23/12;H01L23/498;H01L23/50;H05K3/46;(IPC1-7):H01L23/02;H05K1/16 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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