| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electrolytic copper foil on which through-holes (PTHs), interstitial via holes(IVHs), blind via holes(BVHs) and the like are easily formed on a printed-wiring board. SOLUTION: An organic joint interface layer is formed on the surface of a carrier foil 3, and an electrolytic copper foil layer 5 is separated and formed on the joint interface layer 10 to obtain an electrolytic copper foil with the carrier foil, and as the carrier foil 3, the foil with a face, on which its organic joint interface layer 10 and the electrolytic copper foil layer 5 can be separated and formed and fine copper grains are made to adhere and formed thereon, is used. The fine copper grains are visualized as a color within the range of brown to black, and the grain diameter of fine copper grains is 0.01-5.0μm.</p> |
