| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of peeling of a target from a backing plate, water leakage in a fitting part, abnormal electric discharge, etc., by joining, by the HIP process, a backing plate of hard Al alloy having a recessed part to a target of Al- or Al alloy-containing soft metallic material whose bottom is to be fitted in the above recessed part. SOLUTION: A target 1 is composed of a soft Al type metal of about 20-40 Brinell hardness, such as Al, Al-Ti, and Al-Cr. A backing plate 2 is composed of a hard Al alloy of about 70-100 Brinell hardness of JIS 5052. Joining of the target 1 to the backing plate 2 is performed by the HIP process. Even if sputtering is carried out at high output, the warpage of the backing plate 2 due to the water pressure of cooling water can be prevented by the use of the hard Al alloy of high Brinell hardness for the backing plate 2. Moreover, joining strength can be extremely increased by enlarged joining area, nonuse of bonding material, etc., and peeling of both from each other can be prevented.
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