| 摘要 |
A wall structure (2) and components incorporating such a wall structure that are intended to be exposed to high thermal loads. The wall structure (2) includes at least two layers; a first layer (5) and a second layer (6), the second layer (6) being located closer to a source of the thermal load than the first layer (5). The layers (5, 6) are arranged so that heat is allowed to be conducted from the second layer (6) to the first layer (5). Each of the first and second layers (5, 6) are adapted to carry a significant portion of a structural load, and the second layer (6) exhibits a higher thermal conductivity and/or a lower thermal expansion than the first layer (5) which reduces thermal strain in the wall structure (2).
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