发明名称 |
Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte |
摘要 |
The production of a novel, non-contact smart card (1) is claimed. The electrically-insulating, flat card is made with at least one recess(es) on one side. Conductive track(s) are applied in a given pattern, on the surface of the recessed side. The track(s) are applied on surfaces both within and outside the recess(es). Microcircuit chip(s) (4) are aligned in the recess(es) and brought into contact with the track(s). Also claimed is a contact-less smart card, essentially as described. |
申请公布号 |
DE19639902(C2) |
申请公布日期 |
2001.03.01 |
申请号 |
DE1996139902 |
申请日期 |
1996.09.27 |
申请人 |
ZAKEL, ELKE;SMART PAC GMBH TECHNOLOGY SERVICES |
发明人 |
ASCHENBRENNER, ROLF;ANSORGE, FRANK;ZAKEL, ELKE;KASULKE, PAUL |
分类号 |
G06K19/077;(IPC1-7):G06K19/077;H05K1/18 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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