| 摘要 |
An etchant composition for polyimide resins which comprises the following ingredients (A), (B), and (C): (A) 5 to 67 wt.% quaternary ammonium hydroxide; (B) 3 to 85 wt.% alcohol solvent; and (C) 10 to 70 wt.% water. When used for etching even a polyimide resin having units derived from biphenyltetracarboxylic dianhydride as an acid ingredient, the etchant composition attains a practical etching rate and satisfactory etching accuracy without arousing the fear of contamination with alkali metal ions, halogen ions, or heavy metals and without using a highly toxic ingredient such as ethylenediamine.
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