| 摘要 |
PURPOSE: To provide a plating device adequate for alloy plating consisting of >=2 kinds of metal elements, such as Sn-Cu, Sn-Ag and Sn-Zn, varying in ionization tendency, in addition to Sn-Bi plating. CONSTITUTION: This plating device for the alloy consisting of >=2 kinds of the metal elements varying in the ionization tendency consists of an anode electrode 2 disposed in a plating tank 1, a material 3 to be plated which is a cathode electrode and a plating liquid 4. A dummy cathode 5 which is the cathode electrode is disposed in the plating tank 1. The device is so constituted that the prescribed voltage is impressed to the dummy cathode 5 when the voltage is not impressed to the material 3 to be plated.
|
