| 摘要 |
PURPOSE: To obtain a semiconductor device of package structure which avoids causing damage to a semiconductor chip and is prevented from deteriorating in heat dissipating properties. CONSTITUTION: A semiconductor chip 5 is mounted nearly at the center of a flat-plate board 7, and a ring member 2, ring-shaped adhesive tapes 3, and a flat plate-like heat spreader 1 are laminated on the board 7 to form a hollow where the semiconductor chip is housed, where a slit 4 is provided to the adhesive tape 3 or the ring member 2 to form an air vent.
|
