| 摘要 |
PROBLEM TO BE SOLVED: To increase a non-defective rate (yield) with easy mounting, and reduce manufacture cost. SOLUTION: A method for mounting semiconductor chip comprises the steps of (a) providing a wire frame 3 provided with a pin 30, (b) adhering a first adhesion surface of an insulation tape 4 provided with first and second adhesion surfaces 40, 42 to a pin of the wire frame, and forming a contactor housing space at a portion corresponding to the pin of the wire frame, (c) intermediately packaging a conductive contactor 48 in each contactor housing space, (d) forming a semiconductor chip 5 having an adhesion pad attachment surface 52 provided with an adhesion pad 50, and (e) lowering the fusing point of an adhesive 43 of the second adhesion surface more than a conductive contactor, fusing first the adhesive of the second adhesion surface on the adhesion pad attachment surface of the semiconductor chip, prior to fusing of the conductive contactor by heating, and sealing each conductive contactor airtightly in the contactor housing space. |
