PACKAGING STRUCTURE OF IC CHIP, LIQUID CRYSTAL DEVICE AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To embody a highly reliable conducting and connecting state between an IC chip and a substrate in a packaging structure of the IC chip. SOLUTION: This IC chip packaging structure 3 is constituted by packaging the IC chip 19 having bumps 23 on a substrate 18 having metallic film patterns 22 by an ACF(anisotropic conductive film) 24 in such a manner that the bumps 23 and the metallic film patterns 22 are conducted and connected to each other. The metallic film patterns 22 are patterned and formed so as to extend in the central direction of the IC chip 19 beyond the bumps 23, by which the metallic film patterns 22 of the portions having a sufficient width and thickness may be conducted and connected by evading the convergent parts and tapered thin portions formed at the front ends of the metallic film patterns 22.