| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package, which is capable of keeping a semiconductor element at a proper temperature so as to enable it to operate normally and stably for a long term by a method, wherein a metal heat radiating body is brazed firmly to a metallized metal layer deposited on the outer surface of an insulating Vessel, and heat released from the semiconductor element in operation is dissipated satisfactorily into the air via the metal heat radiating body. SOLUTION: A metallized metal layer 8 is deposited on the outer surface of an insulating vessel 4 which houses a semiconductor element 3, and a metal heat radiating body 9 which contains tungsten and/or molybdenum is brazed to the metallized metal layer 8 for the formation of a semiconductor element housing package, where an electrolytic nickel plating layer 10a and an electroless nickel-phosphorus plating layer 106b are successively deposited on the surface of the metal heat radiating body 9. |
