| 摘要 |
Method and apparatus for a chemical-mechanical-polishing (CMP) support pad structure are described. The support pad structure is made with a housing to hold an open-cell material and a fluid. The fluid is supplied in a gaseous and/or a liquid state to affect rigidity of the pad. By controlling rigidity, material removal rates may be directly affected during CMP processing. Moreover, fluid flow through the support pad structure may be regulated to adjust temperature during CMP processing.
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