| 摘要 |
A dielectric filter device comprising a resonator body formed by arranging a plurality of resonators in parallel in a same direction and a laminated circuit arrangement to be bonded to an open-circuit end surface of the resonator body, wherein a bonding means is provided to mechanically bond them with a sufficient strength and establish required electric connections between them, said bonding means includes solder balls (20) for electrically connecting the resonator body (1a) and the laminated circuit arrangement (10a) bonded to the open-circuit end surface of the resonator body (1a) to produce solder sections p having a uniformly dotted profile. Unlike conventional techniques using an electrically conductive adhesive agent, such solder sections p provide a sufficient bonding strength without requiring any cumbersome operation.
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