METHOD AND LINE FOR PRODUCING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce power consumption of the overall production process or production line by employing single wafer machining units entirely in the production of a device except one of cleaning unit or wet treatment unit. SOLUTION: Number of machining steps of a semiconductor device having one polysilicon layer and two metallization layers is calculated. Among 135 steps thus calculated, only 18 cleaning steps are carried out in butch type machining units shown by black squares and the remaining machining steps are carried out in single wafer machining units. The number of steps using the single wafer machining units is set at 86.7% of the entire number of steps. Butch type machining units are available in total 20 cleaning and wet treating steps. According to the arrangement, power consumption can be reduced over the entire production process or production line.