发明名称 |
ROUND-SHAPED SUBSTRATE CLEANING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To clean a round shaped substrate highly accurately by reducing the possibility of polluting the round-shaped substrate with a pollutant such as particles and preventing cleaning effect of the round-shaped substrate from being influenced by ultrasonic waves emitted from an ultrasonic wave generator. SOLUTION: The round-shaped substrate cleaning apparatus 10 for cleaning round-shaped substrate 100 comprises a plurality of treatment chambers 22, 24, 26, 28 provided on a circumference and respectively having cleaning units for cleaning the round-shaped substrate, a plurality of transporting and supporting members 20 having a plurality of arms extended radially for holding the respective round-shaped substrates and placing the plurality of the round- shaped substrates thus held to positions where the substrates can be cleaned by the respective cleaning units in the treatment chambers and a moving means 18 for relatively moving the positions of the treatment chambers and the arms of the transporting and supporting member, sequentially.
|
申请公布号 |
JP2001029905(A) |
申请公布日期 |
2001.02.06 |
申请号 |
JP19990208391 |
申请日期 |
1999.07.23 |
申请人 |
SHIMADA PHYS & CHEM IND CO LTD |
发明人 |
ABE YUSUKE;OKUDA TSUNEAKI;OKAMOTO MITSUAKI;GONDA MASAMI;SAITO KORETAKA;SUZUKI TOSHINOBU |
分类号 |
B08B7/04;B08B3/04;H01L21/304;(IPC1-7):B08B3/04 |
主分类号 |
B08B7/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|