发明名称 ROUND-SHAPED SUBSTRATE CLEANING APPARATUS
摘要 PROBLEM TO BE SOLVED: To clean a round shaped substrate highly accurately by reducing the possibility of polluting the round-shaped substrate with a pollutant such as particles and preventing cleaning effect of the round-shaped substrate from being influenced by ultrasonic waves emitted from an ultrasonic wave generator. SOLUTION: The round-shaped substrate cleaning apparatus 10 for cleaning round-shaped substrate 100 comprises a plurality of treatment chambers 22, 24, 26, 28 provided on a circumference and respectively having cleaning units for cleaning the round-shaped substrate, a plurality of transporting and supporting members 20 having a plurality of arms extended radially for holding the respective round-shaped substrates and placing the plurality of the round- shaped substrates thus held to positions where the substrates can be cleaned by the respective cleaning units in the treatment chambers and a moving means 18 for relatively moving the positions of the treatment chambers and the arms of the transporting and supporting member, sequentially.
申请公布号 JP2001029905(A) 申请公布日期 2001.02.06
申请号 JP19990208391 申请日期 1999.07.23
申请人 SHIMADA PHYS & CHEM IND CO LTD 发明人 ABE YUSUKE;OKUDA TSUNEAKI;OKAMOTO MITSUAKI;GONDA MASAMI;SAITO KORETAKA;SUZUKI TOSHINOBU
分类号 B08B7/04;B08B3/04;H01L21/304;(IPC1-7):B08B3/04 主分类号 B08B7/04
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