| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for high-frequency waves, which is provided with an antenna element and a high-frequency device, is compact and moreover, can be mass-produced and can be used favorably to a system using high-frequency waves, such as microwaves or millimeter waves. SOLUTION: A package 1 for high-frequency waves is provided with an antenna circuit board A of a constitution, where an antenna element 3 and a high-frequency line 4 for feeding current to the element 3 are formed on the upper and lower surfaces of a first dielectric substrate 2, and a high-frequency device circuit board B of a constitution, where a cavity 8 is formed in one part of a second dielectric substrate 7, a high-frequency device 9 is housed in the cavity 8 and a transfer line 11 for transferring a signal to the device 9 is formed on the upper surface of the substrate 7, and the specific dielectric constant of the substrate 2 of the package 1 of a structure, where with the boards A and B integrally formed by laminating the boards A and B, the line 4 of the board A and the line 11 of the board B are connected with each other, is set at a rate of 2 to 10 and the specific dielectric constant of the substrate 7 of the package 1 is set in the range of 5 to 50. |
