发明名称 INTEGRATED ELEMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To heat a plurality of elements with a low-power heater at high speed and miniaturize a device by arranging the elements which operate in a heat state such as an oxygen sensor or the like of a solid electrolyte directly within a plane of an insulating substrate having the heater built therein. SOLUTION: A conductive heater wiring 6 of a high melting point metal such as platinum, tungsten or the like is buried inside an insulating substrate part 1 of ceramics having insulation properties such as alumina or the like. The insulating substrate part 1 and a plurality of sensor elements 2 disposed to one face, or a front and a rear both faces of the insulating substrate part 1 are heated through the heater wiring 6. A solid electrolyte such as a stabilized zirconia or the like is used for an oxygen ion conduction layer of the sensor element 2. The sensor element is driven at approximately 500 deg.C or higher where a striking ion conductivity is exerted. According to the structure, electric elements operating in a heat state can be rapidly increased and decreased in temperature, and exhibit a desired function in a short time after a driving start. Many kinds of function elements can be arranged in a small area. A constitution of the device can be simplified accordingly.
申请公布号 JP2001027625(A) 申请公布日期 2001.01.30
申请号 JP19990201316 申请日期 1999.07.15
申请人 HITACHI LTD 发明人 FUJITA TAKESHI;ISHIHARA SHOSAKU
分类号 G01N27/41;G01N27/26;G01N27/27;G01N27/409;G01N27/416 主分类号 G01N27/41
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