| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for a printed board which allows piercing of needle-like articles having small diameters via the piercing method, a porous film for a printed board which is a base material for the prepreg and a printed circuit laminate which allows high integration via the piercing method. SOLUTION: A porous film for a printed board prepared via the piercing method comprises at least one heat-resistant resin chosen from resins having a deflection temperature under load of 200 deg.C or higher. The porous film has a coefficient of linear thermal expansion at a temperature ranging from 200 to 300 deg.C of from -50×10-6/ deg.C to +50×10-6/ deg.C, a void volume of from 30 to 95 vol.% and a displacement in a piercing test of 1.5 mm or smaller. A prepreg for a printed board is impregnated with this resin. A printed circuit laminate is prepared using this via the piercing method.
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