| 摘要 |
A method for thinning articles, such as wafers in an IC product, includes applying a reference layer to a first surface of the article to be thinned; removing a portion of the reference layer from its exposed surface to provide a reference surface; and thinning the article by removing a portion of the article from its second surface to provide a thinned surface. The orientation of the reference surface relative to the second surface is controlled, and the orientation of the thinned surface relative to the reference surface is controlled. There are also provided apparatuses and systems which are suitable for use in such methods, as well as intermediate articles and finished products containing articles formed in such methods.
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