| 摘要 |
A system (11) for drying and/or cleaning a workpiece (17A), such as an electronic part, semiconductor wafer, printed circuit board or the like. As the workpiece is withdrawn from a processing or rinsing liquid (13), a selected drying and/or cleaning liquid, such as hydrofluoroether (HFE), an ethylated hydrofluoroether or an azeotrope of a hydrofluoroether or ethylated hydrofluoroether, that has a very small surface tension, is volatile, and has a density much greater than the processing liquid density, is sprayed on, dribbled on, or otherwise transferred to an exposed surface of the workpiece. The workpiece can be dried in 7-45 seconds, or less, in most situations and can be cleaned using the invention. Drying and/or cleaning can be performed in a single workpiece process, a single workpiece, continuous process, or a batch process.
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