| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayered wiring board using a build-up method through which a possibility of interlayer connection failure is reduced. SOLUTION: This method for manufacturing a multilayered wiring board includes the consecutive steps of a step of forming a curing insulation resin layer, a step of selectively forming a via hole in the curing insulation resin layer, a step of etching a metal for a wiring pattern, a step of curing the curing insulation resin layer after etching, and a step of applying a plating treatment for interlayer connection. |
