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发明名称
ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD
摘要
申请公布号
KR20010006399(A)
申请公布日期
2001.01.26
申请号
KR1019997009486
申请日期
1999.10.15
申请人
发明人
分类号
H05K3/18
主分类号
H05K3/18
代理机构
代理人
主权项
地址
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