HYBRID CIRCUIT WITH CONTACT SURFACES (SOLDER PADS)

摘要

A plate-shaped ceramic circuit substrate (6), which is adapted to be vertically mounted on a mother board, has near a lower edge (7) thereof a series of contact areas (solder pads) (1) for contacting the circuit with terminals of the mother board. For improved solderability also in case of small contact area (1), these contact areas extend down as far as the lower edge (7), and there is provided one recess (2) each which constitutes a solder deposit (3) and which extends through the circuit substrate (6) and runs from the lower face side (5) of the circuit substrate (6) upwardly into the respective contact area (1).