| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bonding tool having improved bonding efficiency and bonding quality by implementing stable vibrating performance. SOLUTION: A bonding tool that crimps an electronic component onto a board by applying load and vibration has a configuration such that the centerline CL2 of a sucking section 30 serving also as a bending vibration section, which is coupled to a horn 15 vertically vibrated by a vibrator 17 for converting vertical vibration into bending vibration, and the centerline CL1 of the horn 15 cross each other at a predetermined angleαranging from 90 to 135 deg. within a plane parallel with a biasing direction. As a result of this arrangement, the vibrator 17 can be located remote from the board surface with the configuration and dimensions of the bending vibration section properly set, whereby a bonding tool can be obtained, which exhibits stable vibrating performance free from the influence of heat from the heated board upon the vibrator.
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